As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and ...

Some foundries require cut shapes to be aligned with respect to each other or to another layer. As shown in Figure 6, the Calibre Multi-Patterning tool automatically aligns the cut shapes between ...

Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; ...

The semiconductor manufacturing sector's mission to conform to the demands of Moore's Law has begun to run into a number of significant barriers posed by physical properties. One of these barriers has ...

The semiconductor industry began using multi-patterning technology to fabricate ICs at the 20-nm process node. When we got to 7 nm, the use of self-aligned multi-patterning (SAMP) techniques was ...