Terence Gan, Executive Director of Singapore's A*STAR Institute of Microelectronics (A*STAR IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling ...

From High-Yield to High-Growth: 3 Stocks Boosting Dividends KLA (NASDAQ:KLAC) is seeing stronger momentum across semiconductor equipment markets than it expected earlier in the year, with demand ...

The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

FUJIFILM Corporation announced today that it will present new semiconductor packaging research findings and exhibit its ZEMATES1 product line of photosensitive insulating materials, including ...

STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging. The forum ...

Amman, June 10 (Petra) -- The sixth Jordan Packaging Exhibition (JOPEX 2026) will open Monday at the Jordan International Exhibition Center in Mecca Mall, bringing together 22 leading local companies ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

Advanced packaging mechanisms play a vital role in reducing food waste and ensuring the maintenance of quality during storage. An incredible challenge faced by the food industry is the development of ...

The focus has been on Intel Foundry's ability to compete on fab process nodes. But advanced packaging is the foundation on which it is building its success.