As demand for faster, smaller, and more energy-efficient electronics intensifies, advanced packaging has emerged as a critical enabler of progress in the semiconductor industry. By integrating ...

MediaTek is using Intel's EMIB packaging alongside TSMC's CoWoS for AI ASIC designs, targeting 26% of the AI ASIC market by 2028 amid capacity constraints.

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. In a joint announcement reflecting the growing importance of ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

A coalition of researchers from Stanford, Carnegie Mellon, the University of Pennsylvania, and MIT has demonstrated ...

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits — tiny chips that convey information using light instead of ...

Analyst Ming-Chi Kuo has echoed other reports that Apple is expected to use a new chip packaging technology in the A20 chip, which will debut in the iPhone 18 next year. His report focuses on ...

Can KLAC's rising process control intensity, market-share gains and growing yield-optimization demand fuel its next phase of ...

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

The semiconductor industry is one of the most advanced and complex in the world. The semiconductor industry relies on highly specialized supply chains and manufacturing equipment. This ecosystem ...