Ironwood Electronics has released a spring pin socket for BGA500 devices intended for 23 x 23 mm packages with 0.5 mm pitch.

Available in through-hole, surface-mount, and solderless compression-fit mounting styles, the Quick Lock test sockets accommodate QFN/MLF package types. The devices are offered in all grid sizes in ...

As artificial intelligence (AI) becomes increasingly sophisticated, the demand for higher processing power, speed and ...

For the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now ...

Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...

A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...