TOKYO--(BUSINESS WIRE)--Nikon Corporation has announced release of the NSR-S622D ArF immersion scanner to deliver world-class overlay and ultra-high productivity for the most demanding multiple ...
2019 marked an important milestone for extreme ultraviolet (EUV) lithography. In that year, the EUV patterning technology was for the first time deployed for the mass production of logic chips of the ...
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TSMC's 2nm chip leap challenges ASML's dominance
Taiwan Semiconductor Manufacturing Co. has unveiled a 2nm chip process that can be produced without ASML's costly High-NA ...
Taiwan Semiconductor Manufacturing Co. (TSMC) has unveiled AI chip technologies, including a 2nm process, that it says can be mass-produced without ASML’s costly High-NA lithography machines. By ...
Si2 announced that Cadence has donated extensions to the OpenAccess community which enable physical design tools to represent Multi-Patterned Technology (MPT). Conventional photolithography cannot ...
TSMC is planning to adopt double patterning extensively at 20nm, despite the high cost of doing so. Why? Because EUV hasn't come through. Share on Facebook (opens in a new window) Share on X (opens in ...
After a period of delays, EUV pellicles are emerging and becoming a requirement in high-volume production of critical chips. At the same time, the pellicle landscape for extreme ultraviolet (EUV) ...
As anticipated, this year’s Advanced Lithography + Patterning Symposium was a very informative event, with many interesting papers being presented across a wide range of subjects. Many papers ...
New dry resist technology being developed with ASML and imec will help to extend EUV lithography’s resolution, productivity and yield FREMONT, Calif., Feb. 26, 2020 (GLOBE NEWSWIRE) -- Lam Research ...
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