Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

Not long ago, greater integration between the processing and packaging functions was seen partly as an emerging trend and partly as an interesting possibility—an intriguing “if” out there on the ...

Ultra-thin and energy efficient displays that use organic compounds to emit light have been stirring up excitement in the consumer electronics industry for several years. Researchers have now ...

Is digitalization the future of the paper and corrugated board industry? In this edition of our 'In Conversation With...' ...

On the front-end, 3nm advanced process capacity—currently dominated by TSMC—has become even more constrained, turning into a ...

A research team led by Professor Keon Jae Lee from the Korea Advanced Institute of Science and Technology (KAIST) and by Dr. Jae-Hyun Kim from the Korea Institute of Machinery and Materials (KIMM) has ...

Semiconductor manufacturing equipment maker KLA Corporation (NASDAQ:KLAC) reported Q1 CY2026 results , with sales up 11.5% ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...

SCOTTSDALE, Ariz.--(BUSINESS WIRE)--N2 Packaging Systems, LLC (“N2 Packaging”) is the holder of various patents within the United States, Canada and other international markets relating to its ...