Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX

Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging ...

SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026

SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...
USA Today

Silicon Box Ships 100M Units, Proves Advanced Panel-Level Packaging Ready for AI, HPC era

Breakthrough yield and device performance at high volume show team can scale company’s large-format advanced packaging for customers’ cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...
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Applied Materials to acquire NEXX for AI chip packaging push

Applied Materials will acquire NEXX from ASMPT Limited to enhance its panel-level advanced packaging technology for AI accelerators. The acquisition, which does not require regulatory approval, will ...
Seeking Alpha

Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor ...

The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. Nordson’s industry-leading ASYMTEK Vantage® Series fluid ...
Nasdaq

ACM Research Enters Fan-out Panel Level Packaging Market with Introduction of Ultra C vac-p Flux Cleaning Tool for Chiplets

FREMONT, Calif., July 29, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
Hosted on MSN

Applied Materials to acquire NEXX in AI packaging expansion

Applied Materials has agreed to acquire the NEXX business from ASMPT Limited to expand its panel-level advanced packaging technologies for AI chips. The deal, which requires no regulatory approval, is ...