SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026

SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...
Semiconductor Engineering

Next Steps For Panel-Level Packaging

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...
Semiconductor Engineering

A Hybrid PLP Technology Based On A 650mm x 650mm Platform

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...
DIGITIMES

Lam Research's Salzburg PLP center signals push toward panel production, but hurdles remain for large-scale adoption

Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as ...
The Bakersfield Californian

SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces ...

FREUDENSTADT, Germany, April 30, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is ...
Mena FN

SCHMID Introduces“Any Layer ET” Process For Full Panel-Level Advanced Packaging And Announces Speaking Engagement At ECTC 2026

(MENAFN- GlobeNewsWire - Nasdaq) FREUDENSTADT, Germany, April 30, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and ...