A new technical paper titled “Design and Implementation of Test Infrastructure for Higher Parallel Wafer Level Testing of System-on-Chip” was published by researchers at Inha University and Teradyne. ...
Developing an automated production test solution for current and next-generation complex RF SIP/SOC devices is an increasingly difficult task. Both the test program and the device interface board (DIB ...
The following contributed article was provided by Steve Wigley, vice president of product marketing, and Ian Harrison, senior director of applications for LTX Corp., a supplier of automatic test ...
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