EDN

Power modules benefit from press-fit terminals

Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...
Circuit Digest

Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers

Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV‑D3 mSiC® Power Modules, designed to ...
Rutland Herald

Wolfspeed Introduces New 3.3 kV SiC Power Modules in Two Industry-Standard Footprints to Address the Surging Demand for Energy

Wolfspeed has introduced two new 3.3 kV silicon carbide (SiC) power module families – including high-power half-bridge ...
Electronic Design

Press-Fit pin Enables Solder-Less Assembly

Common inverter construction today features large Through-The-Hole (TTH) components along with smaller SMD devices on one side of the PCB, with the power module mounted on the other side and connected ...

South Korea’s SEMIPOWER Focuses on Next-Generation Wide Bandgap Power Module Technologies

South Korea-based semiconductor company SEMIPOWER is developing next-generation power semiconductor module solutions centered on wide bandgap (WBG) materials including silicon carbide (SiC) and ...
Nasdaq

Alpha and Omega Semiconductor Unveils Its Mega IPM-7 Series Intelligent Power Modules Engineered to Improve Application Performance and Deliver Increased Power Density

New power modules have an optimized high-efficiency, compact, and durable design that is ideal for BLDC motor drives The Mega IPM7 series is AOS’ new generation of intelligent power modules engineered ...