Vacuum reflow soldering technology, although limited in adoption, is emerging as a key focus in high-reliability electronics. While traditional reflow struggles to release trapped gases and form ...
Abstract: The aim of this paper is to investigate temperature and thermal stress responses at various joint arrangements during the cooling stage of the reflow process using an effective numerical ...
In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process has been able to reduce the solder void size to minimum value consistently but there is an ...
As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...
Abstract: With advanced packaging technology’s development, leading foundries and OSATs are pushing the bumping process to a finer pitch of less than 15um. The advantage of doing that leverages ...
The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...
The Vision TripleX from Rehm Thermal Systems is an advanced convection reflow soldering platform designed to deliver excellent process flexibility for modern electronics manufacturing. By combining ...
What a great time to be an electronics hobbyist! Who could have imagined 10 years ago the cool parts that are available for experimentation and projects today: And more! And they’re cheap! The problem ...
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