The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

South Koreas SK Hynix is accelerating its push into the artificial intelligence semiconductor market with a major new ...

Odisha kicks off India’s first 3D chip packaging plant — but why does it matter? What is 3D glass semiconductor technology, ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by the ...

SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park. The ...

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.

Amkor Technology Inc.'s plans to build a $2-billion semiconductor advanced packaging manufacturing plant in Peoria, Ariz., are advancing with support from the U.S. Dept. of Commerce. The Tempe, ...

Odisha takes a major leap into the global semiconductor value chain with the groundbreaking for 3D Glass Solutions Inc.'s ...