Add Yahoo as a preferred source to see more of our stories on Google. Scientists from the federally funded Argonne National Laboratory in Illinois and the University of Virginia have developed a new ...

Longitudinal (top) and axial (middle) images of X-Ray CT data of parts with 6 internal defects: a spherical clog, a stellated shaped clog, a cone shaped void, a blob shaped void, an elliptical warp of ...

New research offers an enhanced understanding of common defects in transition-metal dichalcogenides (TMDs) -- a potential replacement for silicon in computer chips -- and lays the foundation for ...

As advanced packaging pushes deeper into the sub-10µm realm, traditional inspection and metrology systems are being forced to evolve with it. Hybrid bonding, a critical enabler of vertical integration ...

SiC is extensively used in microelectronic devices owing to its several unique properties. However, low yield and high cost of the SiC manufacturing process are the major challenges that must be ...