The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

SANTA ROSA, Calif. - Keysight Technologies , Inc. (NYSE: NYSE:KEYS), a prominent player in the electronic measurement field, has announced the launch of its new 4881HV High Voltage Wafer Test System.

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

TIANJIN — Chinese researchers have achieved a breakthrough in micro-LED wafer testing by developing a nondestructive detection method, thereby addressing a longstanding challenge in ...

New York, July 13, 2021 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Wafer-level Test and Burn-in [WLTBI] Market - Global Industry Analysis, Size, Share, Growth, Trends, ...