As integrated circuit (IC) designs have grown in complexity, scale and speed requirements, design rule checking (DRC) has evolved from a routine step into a critical pillar of successful tapeouts.

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...

IC designers are a lucky bunch. Through many years of semiconductor process evolution, the impact of manufacturing limitations and variations on layout could be encapsulated in relatively simple ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

New Innovator3D IC suite enables faster design completion with capacity, performance, compliance and data integrity Calibre 3DStress delivers early analysis/simulation of chip/package interactions at ...

TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...

The Siemens’ EDA toolset has achieved multiple certifications to support TSMC’s advanced N3A, N3C, N2P, TSMC A16, and A14 ...

Speeding time to market, the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC platform, has been certified for UMC’s chip stacking technologies. UMC’s hybrid bonding solutions support the ...