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Intel's nine-layer ZAM design nears HBM4 performance levels

New memory design: Intel’s ZAM stacks nine layers vertically, delivering about 9GB per module and targeting HBM4-class bandwidth. AI-fueled demand: Rising AI workloads are driving unprecedented demand ...

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's EMIB technology.
Tech Critter

V-COLOR unveils Gen5 JEDEC 8000MT/s 1.1V RDIMM, hits 9600MT/s overclock on Intel W890 platform

V-COLOR has just announced full compatibility of its OC RDIMM memory lineup with Intel Xeon 6 processors and Intel W890 ...
AOL

The High-Bandwidth Memory (HBM) Bottleneck Can Still Cause Micron's Stock to Soar

Over the past few months, there have been few better investment options than Micron (NASDAQ: MU). Its stock was soaring because memory chips were in a huge bottleneck, which caused memory prices to ...

Intel’s stock extends its hot streak. This is the latest source of optimism

The company is reportedly working with South Korea’s SK Hynix on new chip-packaging technology.
Neowin

New clever way to make cheap DDR5 RAM may be Intel-exclusive only with no AMD support

It seems like Intel's good times are coming back. First its upcoming Nova Lake-S desktop CPUs are expected to pack a massive cache and the performance that should come with it. Second the company is ...
DIGITIMES

SoftBank, Intel target HBM limits with 9-layer memory

SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware ...