Vaire Computing has raised a total of $4.5 million in funding. They aim to produce useful reversible computing chips in 2027. They ihad a seed round of $4 million, which was announced on July 1, 2024, ...

Superchips are redefining the backbone of AI and computing, requiring more memory to meet increased demands. As AI models scale in size and complexity, the need for specialized solutions capable of ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...

SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...

Future AI memory chips could demand more power than entire industrial zones combined 6TB of memory in one GPU sounds amazing until you see the power draw HBM8 stacks are impressive in theory, but ...

Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...

TL;DR: SK hynix will showcase its AI memory technologies at CES 2025, featuring solutions for on-device AI and next-generation AI memories. The company aims to highlight its technological ...

Samsung's new codename Shinebolt HBM3e memory features 12-Hi 36GB HBM3e stacks with 12 x 24Gb memory devices placed on a logic die featuring a 1024-bit memory interface. Samsung's new 36GB HBM3e ...

Walk into any modern AI lab, data center, or autonomous vehicle development environment, and you’ll hear engineers talk endlessly about FLOPS, TOPS, sparsity, quantization, and model scaling laws.

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