Vaire Computing has raised a total of $4.5 million in funding. They aim to produce useful reversible computing chips in 2027. They ihad a seed round of $4 million, which was announced on July 1, 2024, ...
Superchips are redefining the backbone of AI and computing, requiring more memory to meet increased demands. As AI models scale in size and complexity, the need for specialized solutions capable of ...
Your next smartphone or PC could be more expensive with lower speed and less memory because of AI datacenters.
An advanced packaging technology has been developed that allows the mechanical stacking of chip-scale memory devices using a fine-pitch ball grid array (FBGA) interface. Significantly reducing ...
SK Hynix and Taiwan’s TSMC have established an ‘AI Semiconductor Alliance’. SK Hynix has emerged as a strong player in the high-bandwidth memory (HBM) market due to the generative artificial ...
The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...
Morning Overview on MSN
The next wave of AI chips with 16-layer HBM4 memory enters volume production this quarter
The first generation of AI accelerators built around high bandwidth memory reshaped the data center. Now the next wave, built ...
The mighty GPU is shaping up to be one of the most significant innovations of human technology during the last few decades. While games such as Alan Wake 2 demonstrate visual chops that can often ...
Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at ...
Samsung Electronics is currently dedicated to the R&D of 11nm level DRAM and ninth-generation 3D NAND Flash. The goal is to raise integration to the highest level in the industry, realize its existing ...
Samsungâ s 128 Gbyte DDR4 DIMM internally uses a four-level silicon stack linked via through-silicon vias (TSVs). Stacking DRAM has been part of the high-bandwidth memory (HBM) systems found in ...
MANHASSET, N.Y. — Packaging IP services company Staktek Holdings Inc. has unveiled a family of flash memory stacking technologies, called FlashStak, aimed at higher capacity, low-cost flash storage ...
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