Applied Materials Broadens Advanced Packaging Portfolio with Acquisition of NEXX

Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging ...

SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026

SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...
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Applied Materials to acquire NEXX for AI chip packaging push

Applied Materials will acquire NEXX from ASMPT Limited to enhance its panel-level advanced packaging technology for AI accelerators. The acquisition, which does not require regulatory approval, will ...
USA Today

Silicon Box Ships 100M Units, Proves Advanced Panel-Level Packaging Ready for AI, HPC era

Breakthrough yield and device performance at high volume show team can scale company’s large-format advanced packaging for customers’ cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...
Seeking Alpha

Nordson Electronics Solutions Develops Panel-Level Packaging Solution for Powertech Technology, Inc. that Achieves Yields Greater than 99% for Underfilling During Semiconductor ...

The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. Nordson’s industry-leading ASYMTEK Vantage® Series fluid ...
Nasdaq

ACM Research Enters Fan-out Panel Level Packaging Market with Introduction of Ultra C vac-p Flux Cleaning Tool for Chiplets

FREMONT, Calif., July 29, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
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Applied Materials to acquire NEXX in AI packaging expansion

Applied Materials has agreed to acquire the NEXX business from ASMPT Limited to expand its panel-level advanced packaging technologies for AI chips. The deal, which requires no regulatory approval, is ...