To address these challenges, MULTIVAC is extending its packaging and automation portfolio with the addition of GS Italia ...

Valmet expands its offering to the growing molded fiber market with the launch of Valmet 3D Fiber technology. The solution enables high-capacity, fast production of high-quality, three-dimensional ...

Samsung Electronics is not only the first company in the world to launch a labor-free semiconductor packaging line, but it has also set a goal of converting its packaging plants to be human labor-free ...

Subscribe to our newsletter for the latest sci-tech news updates. A team in the Department of Sustainable Biomaterials developed a water-based process to create multilayer bioplastic films that are ...

Biodegradable packaging from mycellium and agriculture waste produced by S.Lab for Loreal. A German pharmacist invented polystyrene in 1839. Today, the production of polystyrene produces more than ...

The United States is taking the first steps toward bringing larger-scale IC packaging production capabilities back to the U.S. as supply chain concerns and trade tensions grow. The U.S. is among the ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...