The third type of magnetism could prove the most useful of all—if researchers can identify the materials that exhibit it.

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

New research offers an enhanced understanding of common defects in transition-metal dichalcogenides (TMDs) -- a potential replacement for silicon in computer chips -- and lays the foundation for ...

Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...