The main objective of this project is to let students apply the image processing techniques that been taught in class in a given conditions based on their title. This particular project involved the ...

Geopolitical tensions and pandemic-related disruptions have revealed deep vulnerabilities within the supply chain for manufacturers as well as the businesses and governments that rely on them. In ...

In-circuit test (ICT) has been instrumental in identifying manufacturing process defects and component defects on countless varieties of populated printed circuit board (PCB) assemblies for more than ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

It has taken almost a decade for automated optical inspection (AOI) systems to establish their place on PCB production lines. In the same period, the number of AOI vendors and the variety of AOI ...

Tombstoning is a defect where a two-leaded, wrap-around lead-style termination chip component fails to lay down appropriately and allow solder to simultaneously make a required electrical/mechanical ...