IEEE

An Efficient Location-Connection-Decoupling Layout Design Method for Multi-Chip SiC Modules With Low Electrical and Thermal Impedance

Abstract: Design automation methods have recently garnered significant research interest in providing effective and advanced tools for generating optimal layout solutions for power modules. However, ...
IEEE

A Prototype of 20GHz-Low-Complexity Digital Beamforming Transmitter Antenna Module for FR3 Band Using Direct Digital RF Technology in DSoF Configuration

Abstract: To miniaturize the digital beamforming (DBF) transmitter module, 1-bit bandpass delta-sigma (BP-DS) direct digital RF transmitter using delta-sigma-over-fiber (DSoF) link by 10GE SFP (Small ...
Microwaves & RF

Dev Board Touts a Variety of Sensor and Comm Modules

Enabled by NECTO Studio with full mikroSDK support, MIKROE's Clicker 4 development board for the Renesas R7FA4M2AD3CFP is a complete, ready-to-go solution for building new products and solutions. The ...