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Cleaved cross sections of semiconductor device copper layer were processed by Flat-milling, a kind of BIB (Broad Ion Beam) milling, to mitigate cleavage-induced deformation. Additional 5 minutes Flat milling flattened the cleaved cross sections to allow crystal structure observation and void detection with bright clarity. #Semiconductor #Copper #BIB #FlatMilling #SEM #ElectronMicroscopy #ElectronMicroscope Available tools for this measurement are : BIB milling system https://www.hitachi-hightech
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Cleaved cross sections of semiconductor device copper layer were processed by Flat-milling, a kind of BIB (Broad Ion Beam) milling, to mitigate cleavage-induced deformation. Additional 5 minutes Flat milling flattened the cleaved cross sections to allow crystal structure observation and void detection with bright clarity. #Semiconductor #Copper #BIB #FlatMilling #SEM #ElectronMicroscopy #ElectronMicroscope Available tools for this measurement are : BIB milling system https://www.hitachi-hightech
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